• Single-sided, double-sided or multilayer printed circuit boards
• Maximal format of panel 600 x 450 mm
• Minimal conductor spacing (gap):
• 0,12 mm (6 mil) for 18 µm thickness of copper foil
• 0,15 mm (8 mil) for 35 µm thickness of copper foil
• Minimal trace width (drawing width):
• 0,12 mm (6 mil) for 18 µm thickness of copper foil
• 0,15 mm (8 mil) for 35 µm thickness of copper foil
• Minimal pad – diameter of hole +0,2 mm (for 18 µm thickness of copper foil) (annular width 0.12 mm)
• Minimum drill diameter 0,2 mm (plated through holes -Aspect Ratio 1:10)
• Minimal overlap of photosensitive solder resist 0,2 mm (8 mil)
• Minimal overlap of 2 component solder resist 0,4 mm (16 mil)
• Minimal drawing width of legend 0,2 mm (8 mil)
• Cooper laminate thickness: 18, 35, 70, 105 µm
• Adjusting to final dimension:
• Milling – min. thickness of boards 0,3 mm (tolerance ±0,2 mm)
• Scoring – min. thickness of boards 0,6 mm (tolerance ±0,25 mm)
• shearing
• Electrical test by Fly Probe tester (Mania Loc8)

Notice:

It is possible to order min. quantity of boards which are equivalent 1 technological panel of format 130 x 70 mm).